Product description
This product minimizes the mounting area of semiconductor parts.
It is an innovative substrate made of very thin material with 3-layer structure.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High density
- Ultra slim
- Thickness tolerance control by Layer (PSR / Cu / Resin): Implementation of ultra-slim product
- Optimization of manufacturing process and computerization of process monitoring lead to high reliability
- Warpage control
- Thickness Tolerance control
Product specification
| Category | Specification |
|---|---|
| Layer | 3 Layers |
| Total Thickness | 90 ± 10um |
| Material | Ultra low CTE / High Tg |
| Line and Space | 25 / 25 um |
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