Product description
This product minimizes the mounting area of semiconductor parts.
It is an innovative substrate made of very thin material with 3-layer structure.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High density
- Ultra slim
- Thickness tolerance control by Layer (PSR / Cu / Resin): Implementation of ultra-slim product
- Optimization of manufacturing process and computerization of process monitoring lead to high reliability
- Warpage control
- Thickness Tolerance control
Product specification
Category | Specification |
---|---|
Layer | 3 Layers |
Total Thickness | 90 ± 10um |
Material | Ultra low CTE / High Tg |
Line and Space | 25 / 25 um |
Related News
Date | Title |
---|---|
No items found. |