Product description

This product forms a lead bump that becomes an electrode on the surface of a semiconductor chip. It is manufactured by connecting the chip and the conductor terminal of the substrate via the bump without using a metal wire.

It is a premium value-added product that shortens the connection length among electrode terminals and greatly reduces the loss of high-frequency signals.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

고밀도
High Density
초슬림
Ultraslim
    Implementation of ultra compact and ultra-slim packaging
    Improved signal transmission speed
    Noise reduction for high-frequency bands

Product type

Category Specification
Layer 3/4 Layers
Fine Line / Space ETS (Embedded Trace) 12 / 12 µm
Material Ultra low CTE / High Tg
Bonding Method TCFC

1) TCFC: Thermal Compression Flip Chip Bonding