Product description

This product minimizes the mounting area of semiconductor parts.

It is an innovative substrate made of very thin material with a three-layer structure.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

고밀도
High Density
초슬림
Ultraslim
    Thickness tolerance control by layer (PSR/Cu/Resin) for the implementation of an ultraslim product
    High reliability through the optimization of the manufacturing process and computerization of process monitoring
    Warpage control
    Thickness tolerance control

Product Specification

Category Specifications
Layer 3 Layers
Total Thickness 90 ± 10µm
Material Ultralow CTE / High Tg
Line and Space 25 / 25 µm

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