Product description
This product is a substrate that attaches an integrated circuit (IC) chip, which stores important information required for passports, ID cards, credit cards, etc., on a circuit board and transmits information as an electric signal.
It has two types: contact and contactless. The contact type is divided into a single type and dual type that can enable near-field communication (NFC).
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High Density
- Ultraslim
- Various Surface Treatment Technologies
Compatible for Ni/Au, Ni/Pd, LG sim, ultrasim plating, etc.
- Auto Final Visual Inspection (AFVI)
Improved reliability of error detection through automatic optical inspection
Product Type
| Category | Specification (Single) | Specification (Dual) |
|---|---|---|
| Copper Foil | N/A | 29 / 35 µm |
| Adhesive | N/A | 25 µm |
| Core | Epoxytype PPG | Epoxytype PPG |
| Core Thickness | 100 / 120 µm | 100 / 120 µm |
| Adhesive | 25 µm | 25 µm |
| Copper Foil | 29 / 35 µm | 29 / 35 µm |
| Plating | Ni/Au, Ni/Pd | Ni/Au, Ni/Pd |
Related News
| Date | Title |
|---|---|
| No items found. | |